Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/172736
Kind Code:
A1
Abstract:
Provided are: a radiation-sensitive resin composition with which it is possible to form a resist film that is capable of exhibiting satisfactory levels of sensitivity, LWR performance, CDU performance, pattern rectangularity, and etching resistance; and a pattern formation method. This radiation-sensitive resin composition contains an onium salt compound represented by formula (1), a resin containing a structural unit having an acid-dissociable group, and a solvent. (In formula (1), R1 and R2 each independently are a hydrogen atom, a fluorine atom, or a C1-10 monovalent fluorinated hydrocarbon group. n is an integer of 0-3; when n is 2 or greater, the plurality of R1 and R2 are the same as or different from each other. L is a C3-40 divalent hydrocarbon group including a cyclic structure. R3 is a C1-40 monovalent organic group that does not have an acid-dissociable group. Z+ is a monovalent radiation-sensitive onium cation.)
Inventors:
NEMOTO RYUICHI (JP)
Application Number:
PCT/JP2022/002365
Publication Date:
August 18, 2022
Filing Date:
January 24, 2022
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
C08F20/12; G03F7/004; G03F7/039; G03F7/20
Domestic Patent References:
| WO2015174215A1 | 2015-11-19 | |||
| WO2011115138A1 | 2011-09-22 |
Foreign References:
| JP2019120729A | 2019-07-22 | |||
| JP2020111564A | 2020-07-27 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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