Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/196001
Kind Code:
A1
Abstract:
Provided are: a radiation-sensitive resin composition which can be formed into a resist film having satisfactory levels of sensitivity and CDU performance even when a next-generation technology is applied; and a pattern formation method. The radiation-sensitive resin composition comprises a resin containing a structural unit represented by formula (1), at least one onium salt having an organic acid anion moiety and an onium cation moiety, and a solvent, in which at least a portion of the organic acid anion moiety in the onium salt contains a iodine-substituted aromatic ring structure. (In formula (1), R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms; Y1 represents a bivalent linking group; X1 represents an acid-dissociable group; and n represents 0 or 1.)
Inventors:
MARUYAMA KEN (JP)
Application Number:
PCT/JP2021/046967
Publication Date:
September 22, 2022
Filing Date:
December 20, 2021
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
C07C25/13; C07C309/12; C07C309/39; C07C381/12; C08F22/10; C08F22/20; G03F7/004; G03F7/039; G03F7/20
Domestic Patent References:
| WO2021039244A1 | 2021-03-04 |
Foreign References:
| JP2020181064A | 2020-11-05 | |||
| JP2020112784A | 2020-07-27 | |||
| JP2020106826A | 2020-07-09 | |||
| JP2018018067A | 2018-02-01 | |||
| US20200026188A1 | 2020-01-23 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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