RADIATION SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RADIATION SENSITIVE ACID GENERATOR, AND ACID DIFFUSION CONTROL AGENT

Title:

RADIATION SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RADIATION SENSITIVE ACID GENERATOR, AND ACID DIFFUSION CONTROL AGENT

Document Type and Number:

WIPO Patent Application WO/2023/223624

Kind Code:

A1

Abstract:

The present invention provides a radiation sensitive resin composition, a pattern forming method, etc., capable of achieving, at sufficient levels, sensitivity, LWR performance, and process window when next-generation technology is applied.　This radiation sensitive resin composition comprises a resin that includes a repeating unit A having an acid dissociable group, an onium salt that has an organic acid anion moiety and an onium cation moiety, and a solvent, wherein the onium salt includes at least one group selected from the group consisting of a pentafluorosulfanyl group, a pentafluorosulfanyloxy group, and a pentafluorosulfanylthio group.

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Inventors:

TANIGUCHI TAKUHIRO (JP)
NISHIKORI KATSUAKI (JP)
KINOSHITA NATSUKO (JP)
KIRIYAMA KAZUYA (JP)

Application Number:

PCT/JP2023/006542

Publication Date:

November 23, 2023

Filing Date:

February 22, 2023

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Assignee:

JSR CORP (JP)

International Classes:

G03F7/004; G03F7/039; G03F7/20

Domestic Patent References:

WO2023002869A1

2023-01-26

Foreign References:

JP2019211629A	2019-12-12
JP2018043952A	2018-03-22

Attorney, Agent or Firm:

UNIUS PATENT ATTORNEYS OFFICE (JP)

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