Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/228845
Kind Code:
A1
Abstract:
Provided are: a radiation-sensitive resin composition, from which a resist film capable of exhibiting satisfactory levels of sensitivity, CDU performance, pattern circularity and LWR performance can be formed in the formation of a resist pattern having a high aspect ratio; and a pattern formation method. This radiation-sensitive resin composition comprises a first onium salt compound represented by formula (1), a second onium salt compound represented by formula (2), a resin containing a structural unit having an acid-dissociable group, and a solvent. (In formula (1), R1 represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 5 carbon atoms or a group having such a structure that in which a bivalent hetero-atom-containing group is contained between carbon atoms in a carbon-carbon bond in the aforementioned hydrocarbon group; R2 and R3 each independently represent a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group, or a monovalent fluorinated hydrocarbon group; one of Rf11 and Rf12 represents a fluorine atom and the other represents a hydrogen atom, a fluorine atom, or a monovalent fluorinated hydrocarbon group; m represents an integer of 0 to 8; and Z1 + represents a monovalent radiation-sensitive onium cation.) (In formula (2), R4 represents a monovalent organic group having 1 to 40 carbon atom in which either of a fluorine atom or a fluorinated hydrocarbon group is not bound to an atom adjacent to a sulfur atom; and Z2 + represents a monovalent organic cation.)
Inventors:
NEMOTO RYUICHI (JP)
MIYAKE MASAYUKI (JP)
INAMI HAJIME (JP)
FURUKAWA TSUYOSHI (JP)
OTSUKA NOBORU (JP)
MIYAO KENSUKE (JP)
MIYAKE MASAYUKI (JP)
INAMI HAJIME (JP)
FURUKAWA TSUYOSHI (JP)
OTSUKA NOBORU (JP)
MIYAO KENSUKE (JP)
Application Number:
PCT/JP2023/018526
Publication Date:
November 30, 2023
Filing Date:
May 18, 2023
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
G03F7/004; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2013024756A1 | 2013-02-21 | |||
WO2022113663A1 | 2022-06-02 |
Foreign References:
JP2013520458A | 2013-06-06 | |||
JP2020083760A | 2020-06-04 | |||
JP2018076323A | 2018-05-17 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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