Title:
RADIATOR, CIRCUIT BOARD AND COMPUTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/087389
Kind Code:
A1
Abstract:
The present application provides a radiator, a circuit board and a computing device. The radiator comprises a heat dissipating base plate and heat dissipating fins, and a heat conducting member being provided on the surface, contacting the circuit board, of the heat dissipating base plate; the affinity between the heat conducting member and a solder is superior to that between the heat dissipating base plate and the solder. The present application does not need to perform integral electroplating on the surface of the radiator, but presses the heat conducting member having good heat conductivity and solder affinity to be embedded onto the heat dissipating base plate, the assembly is easy, and no electroplating contamination is produced; as the heat conducting member itself has excellent heat conductivity and solder affinity, the integration between the heat conducting member and the solder is good, the reliability is high, and the heat dissipation performance of the circuit board is good.
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Inventors:
HU HAITANG (CN)
ZOU TONG (CN)
ZOU TONG (CN)
Application Number:
PCT/CN2018/113173
Publication Date:
May 07, 2020
Filing Date:
October 31, 2018
Export Citation:
Assignee:
BITMAIN TECH INC (CN)
International Classes:
H05K1/02
Foreign References:
| TWM286542U | 2006-01-21 | |||
| CN205376498U | 2016-07-06 | |||
| CN203801200U | 2014-08-27 | |||
| CN2444385Y | 2001-08-22 | |||
| CN201397814Y | 2010-02-03 | |||
| US6706972B1 | 2004-03-16 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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