Title:
RADIO FREQUENCY MODULE AND WIRELESS DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/171830
Kind Code:
A1
Abstract:
The present invention provides a radio frequency module comprising: an interposer; a plurality of antenna element groups having first electrodes and second electrodes and configured such that the first electrodes are linearly arrayed at least in a first direction on a first surface of the interposer; and a metamaterial portion provided on the interposer and affecting the electromagnetic characteristics of the plurality of antenna elements. The metamaterial portion includes an electromagnetic bandgap structure provided by forming a predetermined geometric pattern in the vicinity of both sides of the first electrodes along at least the first direction. In this way, the radio frequency module is reduced in size and provides a wide band/high gain.
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Inventors:
IGARASHI TAKAHIRO (JP)
YANAGAWA SHUSAKU (JP)
YANAGAWA SHUSAKU (JP)
Application Number:
PCT/JP2021/001512
Publication Date:
September 02, 2021
Filing Date:
January 18, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01Q1/52; H01Q13/08; H01Q15/14; H01Q21/06
Foreign References:
| US20190312347A1 | 2019-10-10 | |||
| JPH0951224A | 1997-02-18 | |||
| JP2003283239A | 2003-10-03 | |||
| JP2019140644A | 2019-08-22 |
Other References:
ADELA BEDILU BEFEKADU, VAN BEURDEN MARTIJN C., VAN ZEIJL PAUL, SMOLDERS A. BART: "High-Isolation Array Antenna Integration for Single-Chip Millimeter-Wave FMCW Radar", IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, vol. 66, no. 10, 1 October 2018 (2018-10-01), US, pages 5214 - 5223, XP055850261, ISSN: 0018-926X, DOI: 10.1109/TAP.2018.2854286
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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