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Patent Searching and Data


Title:
RADIO WAVE TRANSMISSIVE COVER
Document Type and Number:
WIPO Patent Application WO/2020/195493
Kind Code:
A1
Abstract:
This radio wave transmissive cover comprises: a resin cover base material provided in a path of a radio wave that is sent/received by a device; and a conductive thin film that is provided to the surface of the cover material and that generates heat upon being energized. The conductive thin film includes: a plurality of opening regions, each being formed by an annular hole; and a plurality of resonance regions, each being surrounded by a respective opening region so as to be insulated. The opening regions and the resonance regions are positioned with intervals therebetween so as to be arranged regularly on the conductive thin film. The size of each resonance region is set such that when the radio wave is incident into the resonance region, a radio wave having a wavelength equivalent to that of the radio wave is output. The intervals between the opening regions are set so as to satisfy a heat generation performance required of the conductive thin film.

Inventors:
DOKE SHINICHI (JP)
KOJIMA EIJI (JP)
Application Number:
PCT/JP2020/007819
Publication Date:
October 01, 2020
Filing Date:
February 26, 2020
Export Citation:
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Assignee:
TOYODA GOSEI KK (JP)
International Classes:
G01S13/931; G01S7/03; H01Q1/42
Domestic Patent References:
WO2019039517A12019-02-28
Foreign References:
JP2014158073A2014-08-28
CN204125790U2015-01-28
US4999639A1991-03-12
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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