Title:
REACTIVE HOT-MELT ADHESIVE, BONDED OBJECT AND PRODUCTION METHOD THEREFOR, AND GARMENT
Document Type and Number:
WIPO Patent Application WO/2022/210408
Kind Code:
A1
Abstract:
Disclosed is a reactive hot-melt adhesive which comprises a urethane prepolymer having structural units derived from a polyol and structural units derived from a polyisocyanate, a phenolic antioxidant, and an ultraviolet absorber. The structural units derived from a polyisocyanate include structural units derived from diphenylmethane diisocyanate.
Inventors:
HISANO KAZUKI (JP)
KOMIYA SOUICHIROU (JP)
SAITO KOICHI (JP)
QU SHUJIE (JP)
YAMATO RYOSUKE (JP)
SUE RIKA (JP)
KOMIYA SOUICHIROU (JP)
SAITO KOICHI (JP)
QU SHUJIE (JP)
YAMATO RYOSUKE (JP)
SUE RIKA (JP)
Application Number:
PCT/JP2022/014610
Publication Date:
October 06, 2022
Filing Date:
March 25, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J11/00; C09J11/06; C09J175/04
Foreign References:
| CN111040717A | 2020-04-21 | |||
| CN108251039A | 2018-07-06 | |||
| JP2008063568A | 2008-03-21 | |||
| JP2016535121A | 2016-11-10 | |||
| JP2017105992A | 2017-06-15 | |||
| JP2003103728A | 2003-04-09 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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