Title:
REFLOW SOLDERING DEVICE AND REFLOW SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/070264
Kind Code:
A1
Abstract:
In the present invention, when a power module (12) is soldered to a heatsink (15), steam which is temperature-adjusted to at least the melting point of a solder (13) is introduced from a steam generating tank (2) into the flow path provided in the heatsink, the heatsink (15) is heated, and the solder (13) is melted. Inert gas is introduced into a soldering tank (1) from another route so as not to mix with the steam supplied to the heatsink (15). Voids in the solder (13) are reduced and condensed by pressure regulation and as a result the negative impact of voids is eliminated.
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Inventors:
BESSHI NORIYUKI (JP)
NAKAJIMA DAI (JP)
MAEKAWA HIROTOSHI (JP)
ISHIBASHI SATOSHI (JP)
NAKAJIMA DAI (JP)
MAEKAWA HIROTOSHI (JP)
ISHIBASHI SATOSHI (JP)
Application Number:
PCT/JP2011/062361
Publication Date:
May 31, 2012
Filing Date:
May 30, 2011
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
BESSHI NORIYUKI (JP)
NAKAJIMA DAI (JP)
MAEKAWA HIROTOSHI (JP)
ISHIBASHI SATOSHI (JP)
BESSHI NORIYUKI (JP)
NAKAJIMA DAI (JP)
MAEKAWA HIROTOSHI (JP)
ISHIBASHI SATOSHI (JP)
International Classes:
H05K3/34; B23K1/008; B23K1/015; B23K3/04; B23K31/02
Foreign References:
| JP2007180458A | 2007-07-12 | |||
| JPH08340177A | 1996-12-24 | |||
| JP2005294561A | 2005-10-20 | |||
| JP2005353965A | 2005-12-22 | |||
| JP2005205418A | 2005-08-04 |
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
Masuo Oiwa (JP)
Masuo Oiwa (JP)
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Claims: