Title:
REFLOW SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2003/098982
Kind Code:
A1
Abstract:
A reflow soldering device where a substrate (5) mounted with electronic components is transported by a conveyor (4) in a device partitioned into chambers (1), (2), (3). Blowers (6) are installed in the chambers (1), (2), (3). The centers of blade wheels of an adjacent set of the blowers (6) are not on a vertical plane along a transportation line but are so arranged as to be displaced from each other in a left-right direction. It may also be structured such that the centers of blade wheels of an adjacent set of the blowers are not on a horizontal plane but are so arranged as to be displaced from each other in an up-down direction. Further, it may also be structured such that the blowers are arranged with their rotation shafts inclined.
Inventors:
YOKOTA YATSUHARU (JP)
Application Number:
PCT/JP2003/005589
Publication Date:
November 27, 2003
Filing Date:
May 01, 2003
Export Citation:
Assignee:
YOKOTA TECHNICA LTD COMPANY (JP)
YOKOTA YATSUHARU (JP)
YOKOTA YATSUHARU (JP)
International Classes:
B23K1/008; B23K1/012; B23K3/04; (IPC1-7): H05K3/34; B23K1/008
Foreign References:
| JPS6483395A | 1989-03-29 | |||
| JPH0715120A | 1995-01-17 | |||
| JPH11186707A | 1999-07-09 | |||
| JPH03218093A | 1991-09-25 | |||
| JPH07142855A | 1995-06-02 |
Attorney, Agent or Firm:
Okabe, Kenichi (Central Nishishinjuku 9-5, Nishishinjuku 8-chom, Shinjuku-ku Tokyo, JP)
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