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Title:
REFRACTORY MATERIAL
Document Type and Number:
WIPO Patent Application WO/2024/038720
Kind Code:
A1
Abstract:
This refractory material is bonded to a SiC-containing aggregate by a bonding part composed of Si, Al, O, and N. According to the refractory material, the proportion of SiC in the refractory material is 60-90 mass%, and the proportions of respective elements constituting the bonding part are 0.1-1.1 mass% for Si, 4-21 mass% for Al, 4.8-19 mass% for O, and 7.2-13.1 mass% for N.

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Inventors:
KOMIYAMA TSUNEO (JP)
HASEGAWA MASAAKI (JP)
HOSHINO TOMOYA (JP)
Application Number:
PCT/JP2023/026121
Publication Date:
February 22, 2024
Filing Date:
July 14, 2023
Export Citation:
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Assignee:
NGK INSULATORS LTD (JP)
NGK ADREC CO LTD (JP)
International Classes:
C04B35/567; C04B35/599; F27D1/00; F27D3/12
Foreign References:
JPH10500095A1998-01-06
JP2016538212A2016-12-08
JPS63129072A1988-06-01
JPS6197165A1986-05-15
US5521129A1996-05-28
CN102050625A2011-05-11
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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