Title:
REFRIGERANT CIRCUIT UNIT
Document Type and Number:
WIPO Patent Application WO/2024/042983
Kind Code:
A1
Abstract:
[Problem] To reduce heat loss that occurs between a flow path through which a high-pressure refrigerant flows and a flow path through which a low-pressure refrigerant flows, and to improve the system efficiency of a refrigerant circuit. [Solution] Provided is a refrigerant circuit unit comprising a refrigerant circuit including a compressor, a heater, an expansion mechanism, a cooler, and a flow passage module formed integrally with at least a portion of a refrigerant flow passage that allows a refrigerant to flow through the compressor, the heater, the expansion mechanism, and the cooler, and a supporting plate for supporting the refrigerant circuit, wherein the flow passage module includes: a high-pressure side region provided with a high-pressure flow passage through which a high-pressure refrigerant flows; a low-pressure side region provided with a low-pressure flow passage through which a low-pressure refrigerant flows; and a dividing portion which is provided between the high-pressure side region and the low-pressure side region to divide the high-pressure side region and the low-pressure side region.
Inventors:
FURUSHIMA SHINTARO (JP)
FUKUDA KOJI (JP)
KANO TOMOMI (JP)
FUKUDA KOJI (JP)
KANO TOMOMI (JP)
Application Number:
PCT/JP2023/027528
Publication Date:
February 29, 2024
Filing Date:
July 27, 2023
Export Citation:
Assignee:
SANDEN CORP (JP)
International Classes:
F25B1/00; F25B31/00
Foreign References:
| CN114502396A | 2022-05-13 | |||
| JP2001227777A | 2001-08-24 | |||
| CN215724315U | 2022-02-01 | |||
| JP2014163578A | 2014-09-08 |
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