Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
REFRIGERANT CYCLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/230436
Kind Code:
A1
Abstract:
The present invention comprises: a branching part (16) that divides a refrigerant that has been depressurized by a first depressurization part (13); a second depressurization part (17) that depressurizes refrigerant from one branch of the branching part (16); an ejector (14) that has a nozzle part (14a) that depressurizes refrigerant from the other branch of the branching part (16), a refrigerant suction port (14b) that suctions refrigerant by means of the suction effect of refrigerant that is sprayed from the nozzle part (14a), and a pressurization part (14d) that mixes and pressurizes refrigerant that has been sprayed from the nozzle part (14a) and refrigerant that has been suctioned through the refrigerant suction port; a suction-side heat exchanger (18) into which refrigerant that has been depressurized by the second depressurization part (17) flows and from which refrigerant is suctioned by the refrigerant suction port (14b); an outflow-side heat exchanger (15) into which refrigerant that has been pressurized by the pressurization part (14d) flows and out of which refrigerant flows toward a compressor (11); and a control part (30) that controls the throttle opening of the first depressurization part (13) such that refrigerant that has flowed out of a radiator (12) is supercooled to a prescribed degree.

Inventors:
SAKURAI DAISUKE (JP)
OSHITANI HIROSHI (JP)
KAWAMOTO YOICHIRO (JP)
NAGANO YOHEI (JP)
MAEDA HIROSHI (JP)
YUAN HANG (JP)
Application Number:
PCT/JP2019/019611
Publication Date:
December 05, 2019
Filing Date:
May 17, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENSO CORP (JP)
International Classes:
F25B5/04; B60H1/32; F25B1/00
Domestic Patent References:
WO2014155545A12014-10-02
Foreign References:
JP2007078339A2007-03-29
JP2008304078A2008-12-18
JP2009002576A2009-01-08
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
Download PDF: