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Patent Searching and Data


Title:
REFRIGERATION CYCLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/215167
Kind Code:
A1
Abstract:
A refrigeration cycle device according to the present invention comprises: a compressor (11) that compresses and discharges a refrigerant; a heat dissipating section (16) that dissipates the heat of the refrigerant discharged from the compressor; a cooling decompression section (14b) that decompresses the refrigerant that has been subjected to heat dissipation at the heat dissipating section; an air-conditioning evaporation section (18) that exchanges heat between air and the refrigerant decompressed at the air-conditioning decompression section, evaporates the refrigerant, and cools the air; a cooling decompression section (14c) that decompresses the refrigerant that has been subjected to heat dissipation at the heat dissipating section; cooling sections (19, 52) that cool a battery by using heat from the battery to evaporate the refrigerant that has been decompressed at the cooling decompression section; and a gas-liquid separation section (21) that separates gas and liquid of refrigerant that has flowed out from the air-conditioning evaporation section and the cooling sections, returns the refrigerant in a gas phase to the compressor, and returns a refrigerating machine oil to the compressor. At least one of the air-conditioning decompression section and the cooling decompression section is controlled such that the refrigerant that has flowed out from the air-conditioning evaporation section has the degree of superheat.

Inventors:
ITOH SATOSHI (JP)
SUZUKI SATOSHI (JP)
SHIRATORI KOUSUKE (JP)
Application Number:
PCT/JP2021/011581
Publication Date:
October 28, 2021
Filing Date:
March 22, 2021
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
F25B5/02; F25B1/00; F25B43/02
Foreign References:
JP2019211197A2019-12-12
JP2003262418A2003-09-19
JP2014095484A2014-05-22
JP2012225637A2012-11-15
JP2019045034A2019-03-22
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
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