RELATED APPLICATIONS

Thisapplication claims priority to U.S. Provisional Application Serial No.62/120,020, filed on February 24, 2015 entitled "REFRIGERATION HEAT RECLAIM", the entirety of which is inoorporated by reference herein.

FIELD

The present concepts relate generally tothefield of refrigeration, and more specifically, to refrigeration heat reelaim systemsand methods.

BACKGROUND

Refrigeration systems requirea significant amount of energy to operata Heat generated by refrigeration systems istypicalIy dissipated aswaste heat to theenvironment.

BRIEF SUMMARY

In oneaspect, provided isa refrigeration heat reclaim unit, comprising: a heat exchanger, comprising: arefrigerant inlet that receivesaflow of refrigerant having afirst state; arefrigerant outlet that outputsthefIow of refrigerant having asecond state; awater Icop inlet that receives a fIow of Iiquid at afirst temperature; awater Icop outlet that outputsthefIow of Iiquid from the reelaim heat exchanger at asecond temperaturethat is greater than thefirst temperature in response to theflow of refrigerant. The refrigeration reclaim unit also comprisesa refrigerant flow control device having outputsto the refrigerant inlet and an air-cooled condenser, respectively for controlIing thefIow of refrigerant to at Ieast one of the refrigerant inlet and the air-cooled condenser for maintaining a predetermined flow quality valueat the refrigerant outlet.

I n someembodimerits, the refrigerant fIow control device includes athree-way massfIow diverting valve.

I n someembodiments, thethree-way massfIow diverting valve is a modulating, Iinear valve that performsanalog modulation.

In someembodiments, the refrigerant flow control device comprises: an input port for receiving theflow of refrigerant from a refrigerant compressor; afirst output port that outputs afirst proportion of theflow of refrigerant to the heat exchanger; and asecond output port that outputs a second proportion of theflow of refrigerant to theair cooled condenser.

In someembodiments, the refrigerant flow control device achievesor supportsa massflow balance.

In someembodiments, the refrigerant flow control device monitors refrigerant pressure and temperatureat the refrigerant inlet and the refrigerant outlet for controlling theflow of refrigerant. I n some embodiments, the first state is a saturated vapor and the second state is a saturated liquid.

I n some embodiments, the system further comprises a bypass device between the refrigerant inlet and the refrigerant outlet that outputs a proportion of refrigerant to an a r-cooled condenser in responseto a high refrigerant temperature or a high refrigerant pressure

In some embodiments, the refrigerant fIow control devicecontrolsthe fIow of refrigerant simultaneously to the refrigerant inlet and the air-cooled condenser for maintaining a predetermined flow quality value at the refrigerant outlet.

I n another aspect, provided is a refrigerant mass fIow system, comprising a refrigerant fIow control device comprising an input port for receiving a fIow of refrigerant from a refrigerant compressor; a first output port that outputs a first proportion of thefIow of refrigerant to a heat exchanger; and a second output port that outputs a second proportion of theflow of refrigerant to an ai r cooled condenser, and a controlIer for control I ing the first and second proportions of refrigerant for maintaini ng a predetermined fIow quality value at an outlet of the heat exchanger.

In some embodiments, thefirst proportion of thefIow of refrigerant may be output to the heat exchanger asa saturated vapor, and theflow of refrigerant at the outlet of the heat exchanger isa saturated liquid.

Thefirst proportion of theflow of refrigerant isoutput to the heat exchanger as a saturated vapor, and thefIow of refrigerant at the outlet of the heat exchanger is a saturated Iiquid.

In some embodiments, the refrigerant massflow system may further comprise a bypass device between the refrigerant inlet and the refrigerant outlet that outputstheflow of refrigerant to an air-cooled condenser in responseto high refrigerant temperature or high refrigerant pressure.

In some embodiments, the refrigerant flow control device may control theflow of refrigerant simultaneously to the heat exchanger inlet and the air-cooled condenser for maintaining a predetermined fIow quality value at the heat exchanger outlet.

I n another aspect, provided is method for controlI ing a fIow of refrigerant at a refrigeration system, comprising: measuring atemperatureand pressure of aflow of refrigerant at a refrigerant outlet of a heat exchanger; comparing the measured refrigerant temperature and pressure to a reference pressure-temperature setpoint; and modulating a refrigerant flow control device in response to thecomparison.

I n some embodiments, modulating the refrigerant fIow control device may comprise controlling theflow of refrigerant to at least one of a refrigerant inlet of the heat exchanger and an ai r-cooled condenser for maintaining a predetermined fIow qual ity valueat the refrigerant outlet. In someembodiments, the refrigerant flow control device may control theflow of refrigerant simultaneous!y to the refrigerant inlet and theair-cooled condenser for maintaining a predetermined flow quality value at the refrigerant outlet.

In someembodiments, modulating the refrigerant flow control devicemay comprise receiving at the refrigerant flow control devicetheflow of refrigerant from a refrigerant compressor; outputting from afirst output port afirst proportion of theflow of refrigerant to the heat exchanger; and outputting from asecond output port a second proportion of theflow of refrigerant to an air cooled condenser.

In someembodiments, the method may further comprise monitoring refrigerant pressureand temperatureat each of the refrigerant inlet and the refrigerant outlet for controlling theflow of refrigerant.

I n someembodimerits, the method may further comprise receiving at a refrigerant inlet of the heat exchanger aflow of refrigerant having afirst state; and outputting at a refrigerant outlet of the heat exchanger theflow of refrigerant having a second state.

I n someembodiments, thefirst state isa saturated vapor and the second state isa saturated liquid.

I n someembodiments, the method may further comprise coupling a bypass device between the refrigerant inlet and the refrigerant outlet that outputs a proportion of refrigerant to an air-cooled condenser in responseto high refrigerant temperatureor high refrigerant pressure.

BRIEF DESCRIPTION OF THE SEVERAL VI EWS OF THE DRAWINGS

The aboveand further advantages may be better understood by referring to thefolIowing description in conjunction with theaccompanying drawings, in which Iike numerals indicate Iike structural elementsand features in variousfigures. Thedrawingsare not necessarily to scale, emphasis instead being piaced upon i11ustrating the principiesof the

FIG.1 isa perspective view of a refrigeration heat reclaim unit, in accordancewith some embodiments;

FIG.2A isafront view of the refrigeration heat reclaim unit of FIG.1, in accordancewith some embodiments;

FIG.2B isa sideview of the refrigeration heat reclaim unit of FIGa 1 and 2A, in accordance with someembodiments;

FIG.2C isatop view of the refrigeration heat reclaim unit of FIGs.1, 2A, and 2B in accordancewith someembodiments;

FIG.3 isa schematic diagram of a refrigeration cycle, in accordancewith some

embodiments;

FIG.4 isaflow diagram illustrating a method for controlling aflow of refrigerant between a reelaim heat exchanger and a condenser, in accordancewith someembodiments; and FIG.5 is a pressure-enthalpy (p-h) diagram for a refrigeration cycle, in accordancewith some embodi ments.

DETAILED DESCRIPTION

Refrigeration heat reclaim is afeature of some refrigeration systems, whereby heat generated during a refrigeration operation which would otherwise bewasted at a condenser can be recovered and diverted for another useful purpose, such asasource of heat for another fluid stream (i.e, a gaseous or Iiquid substance) havi ng a Iower temperature requirement. In doi ng so, theamount of energy purchased for use by the refrigeration system can be reduced in favor of reclaimed energy that would otherwise be exhausted to the environment.

FIG.1 is a perspective view of a refrigeration heat reelaim unit 10, in accordancewith some embodi menta FIG.2A is a front view of the refrigeration heat reclaim unit 10 of FIG.1, in accordancewith some embodiments. FIG.2B isasideview of the refrigeration heat reclaim unit 10 of FIGs.1 and 2A, in accordance with some embodiments. FIG.2C is a top view of the refrigeration heat reclaim unit 10 of FIGs.1, 2A, and 2B in accordance with some embodi ments,

The refrigeration heat reelai m unit 10 i ncludes a reelaim heat exchanger 20 and a refrigerant flow control device 30 positioned in a housing 110, along with an expansion tank 124 and a pump 126 for ci rculating heat exchanger fIuid, an electrical panel 128, and a set of inletsand outletsfor coupling with variousother elements of a refrigeration system, for example, illustrated at FIG.3. Various pumps, switches, valves, sensors, and the I ike (not shown) can also be positioned at the housing 110 for providing paralIel massfIow i n accordance with some embodiments.

Coupled to the heat exchanger 20 in the housing 110 of the refrigeration heat reclaim unit 10 includes a water loop supply outlet 102, a water loop supply inlet 104, and a liquid refrigerant outlet 106. Also coupled to the heat exchanger 20 is an outlet 134 of theflow control device 30, which controlstheflow of refrigerant according to temperature and pressureat the heat exchanger inlet 108. Thewater Icop supply inlet 104 receiveswater or other cooli ng fIuid or gasfor reducing a temperatureof superheated refrigerant in the heat exchanger 20 received via theflow control device 30. Thewater loop supply output 102 outputs the circulating fluid liquid or gas heated by the heat from the refrigerant flowing through the heat exchanger 20. The liquid refrigerant outlet 106 outputs the refrigerant cooled by the circulating fluid. The refrigerant can thereforetransition at the reclaim heat exchanger 20 from a superheated vapor, for example, output from a compressor 16 (see Fl G.3), to a I iquid dueto removal of heat from the refrigerant by the circulating cooling fIuid.

The expansion tank 124 may absorb excesswater pressure caused by thermal expansion with respect to thewater or other fluid received at thewater loop supply inlet 104, which is heated during heat transfer from the refrigerant at the reelai m heat exchanger 20. A fIuid path 127 extends between the expansion tank 124 and the water Ioop supply inlet 104. A fluid pump 126 can be provided along thewater loop supply inlet 104 for providing a supply of water or other cool ing fIuid to a heati ng Ioad.

The electrical panel 128 provides power via a power source, i.e., battery, electrical outlet, and so on to the various elements of the uni1100 via electrical connectors (not shown). The electrical panel 128 can also include some or all interconnections between a refrigerant fIow controlIer 40 (see FIG.3) and various sensors 109, pumps, valves, and/or the reclaim heat exchanger 20 and theflow control device 30 that exchange signalswith the controlIer 40 and/or each other for controlIi ng a massfIow in accordancewith some embodiments.

A bypassdevice 22 can extend between an inlet 136 of the refrigerant fIow control device 30 and an outlet 136 of the refrigerant fIow control device 30 that outputs a proportion of refrigerant to an air-coded condenser. The bypass device 22 can include a 2-way solenoid valve or the Iike that functions asa safety bypassto bypassthe heat reelaim elements. For example, the bypass device 22 can be activated in responseto high refrigerant temperature or high refrigerant pressure The bypass device 22 can also act in response to high fIuid temperature on the Icop 12 or when thefIuid pump 126 experiencesa loss of flow or mechanical/electrical failura

FIG.3 is a schematic diagram of a refrigeration cycle, in accordancewith some

embodi ments. I n describi ng the refrigeration cycle, reference is madeto elements of the redaim heat exchanger 20 of FIGs.1 and 2A-2C, which is part of a closed refrigeration system for recapturing waste heat. Other elements of the refrigeration system can i nclude, but not be I i mited to afI uid cooling circuit 12, air-cooled condenser 14, aliquid receiver 15, and a compressor 16. Other elements may be part of the refrigeration cycle but not shown, such as an evaporator, aswel I as various pumps, switches, valves, sensors, and the Iikefor controlling theflow, temperature, pressure, and/or state of refrigerant and/or cooling fluids, respectively. For example, in some parts of the cycle, the refrigerant isaliquid, and in other parts of the cycle, the refrigerant is a gasor vapor.

The refrigeration cycle includes both a cool ing fIuid Icop and a refrigerant Icop for providi ng a parallel massflow between theair-cooled condenser 14 and the reclaim heat exchanger 20 which in some embodiments is part of the heat reelai m uni110. The reelaim heat exchanger 20 receives a fIow of fluid from the fluid cooling circuit 12, for example, including a cooling tower, fluid to air heat exchanger or the I i ke, for cooling aflow of refrigerant received by the heat exchanger 20. More spedfically, water or other fI uid Iiquid or gas circulates through the heat exchanger 20 via the water loop inlet 104, which receives a flow of fluid from thefluid cooling drcuit 12 for cooling aflow of refrigerant at afirst state, e.g., a vapor, received at a refrigerant inlet. Accordingly, heat is removed from the refrigerant flow and is exchanged or transferred to the circulating fluid liquid or gas of the fluid cooling drcuit 12. Indoingso, the temperature and pressure of the refrigerant flow through the heat exchanger 120 is reduced. The cooled fIow of refrigerant isoutput from the refrigerant outlet 106 to the liquid receiver 15 in a9econd state, e.g., a liquid. Theflow of fluid circulating through the fIuid cooling circui112 can be controlIed in any desired manner known to those of ordinary ski11 in the art, for example, through the useof valves or the Iike.

In someembodiments, the refrigerant flow control device 30 includesa modulating, linear, three-way refrigerant massflow diverting valvefor controlling aflow of refrigerant received from the compressor 16. The refrigerant fIow control device 30 includesan inlet 136 in communication with a compressor 16, afirst outlet 134 in communication with a refrigerant inlet 108 of the reelaim heat exchanger 20, and asecond outlet 132 in communication with an air-cooled condenser. A refrigerant flow controller device40 is used for monitoring refrigerant pressure and temperatureat the refrigerant inlet 108 and outlet 106, and determining or calculating the massflow ratio, or ratio of high-temperature massflow rateat inlet 108 to low-temperaturecircuit massflow rateat outlet 106. Refrigerant flow controller 40 providescontrol action, by meansof electronic or communication signal or instruction, to refrigerant massflow diverting control valve 30 such to maintain a predetermined refrigerant massflow quality valueat the refrigerant outlet 106.

Thecompressor 16 receivesthe refrigerant from a Ioad 17, for example, a deviceor system that controlsthefIow of gaseous refrigerant into thecompressor 16. Here, the Iiquid refrigerant experiences pressureand/or temperature changes, for example, adrop in pressure and rise in temperaturesuch that the Iiquid refrigerant vaporizes into asuperheated gas prior to entering the compressor 16, which compressesthe refrigerant to a high temperature, high pressurecompressed refrigerant vapor or gas provided to the refrigeration heat redaim system 10 in a controlIed manner by theflow control device 30.

At the reclaim heat exchanger 20, heat of the superheated refrigerant vapor is removed from the refrigerant and transferred to thecirculating fluid, e.g., water, from thefluid cooling circuit 12 having a Iower temperaturethan the refrigerant fIowing through the reelaim heat exchanger 20. Accordingly, theflow of refrigerant cooled by the circulating fluid is condensed and output from the reclaim heat exchanger 20 tothe liquid receiver 15 in a liquid state.

The refrigerant flow control device 30 is positioned along a refrigerant flow path between the compressor 16 and the reelaim heat exchanger 20 for controlIing afIow of the refrigerant to the reclaim heat exchanger 20, more specifically, dividing and controlling superheated refrigerant mass fIowsbetween, and with respect to, the air-cooled condenser 14 and/or the reelaim heat exchanger 20 to maintain a specific refrigerant saturated condensing pressureand temperatureasto control a refrigerant quality ('χ') value of x = 0.0 at the heat exchanger outlet 106, whereasthe quality is represented asthe refrigerant statecoincident with the saturated Iiquid Iineassociated with the specific refrigerant 'pressure-enthalpy' chart, therefore providing maximum heat exchanger effectivenesswhileensuring a solid liquid state existsto mergewith the liquid output of theair- cooled condenser 14. A quality value of x = 0, or a refrigerant statecoincident with the saturated liquid line on the pressure-enthalpy chart, representsthe maximum latent heat transfer potential of the chemical compound.

The refrigerant flow control device 30 receives superheated refrigerant massflow from the compressor 16 and includesafirst outlet 134 for outputting afirst proportion of superheated refrigerant gas massfIow to the reelaim heat exchanger 20, and a second outlet 132 for outputting a second proportion of superheated refrigerant gas massfIow to theair-cooled condenser 14. Reelaim heat exchanger 20 and/or air-cooled condenser 14 providesfor condensing thesuperheated refrigerant prior to outputting tothe Iiquid receiver 15. Thefirst proportion of superheated refrigerant massfIow outputting from refrigerant fIow control device 30 can enter the reelaim heat exchanger 20 simultaneously with the second proportion of superheated refrigerant massflow to the air-cooled condenser 14. The refrigerant flow control device 30 can control theflow of refrigerant simultaneously to the refrigerant inlet 108 and theair-cooled condenser 14 for maintaining a predetermined flow quality value at the refrigerant outlet 106.

Thecontroller 40 can monitor refrigerant pressureand temperaturealong the refrigerant flow path and instruct or direct refrigerant flow control device 30, morespecifically, using flow meters, sensors, or the Iike, at the refrigerant inlet 108 and outlet 106 of the reelaim heat exchanger 20 along the refrigerant fIow path. The controlIer 40 controlsthefirst and second proportionsoutput from the refrigerant flow control device 30, and determining a massflow ratio, to maintain a predetermined flow quality value at the refrigerant outlet. For example, the controller 40 can instruct theflow control device 30 to allow a required refrigerant massfIow needed to satisfy acurrent heating demand to pass into the reelaim heat exchanger 20, whiIe directing alI remaining massfIow to the existing air cooled condenser. Thetwo heat exchanger outlet liquid streams, condenser and heat reclaim, are returned to the liquid receiver separately. In someembodiments, as shown in FIG.1, the controller 40 isco-located with the reclaim heat exchanger 20 and/or theflow control device30. In other embodiments, the controller 40 isexternal to therefrigeration heat reclaim system 10, and remotely controlsthe massflow ratio corresponding to refrigerant quality at theflow control device 30. The controlIer 40 can include a hardware processor and memory having contentsthat are executed by the hardware processor to perform thefunctionsof thecontrolIer 40.

The refrigerant flow control device 30 providesfor reclamation of waste heat without requiring physical elevation of the reelaim heat exchanger 20 abovethe air-cooled condenser 14 required with conventional heat reelaim approaches. In conventional seriesfIow configurations, a heat exchanger output must beabove a condenser inlet in order for gravity to causefluid flow to occur. In the refrigeration system according to embodiments, the reelaim heat exchanger 20 can includea refrigerant outlet 106 that isabovethe liquid receiver 15, which is typically arranged to be below thecondenser 14. The refrigeration heat reclaim unit can beoriented in a horizontal or vertical configuration, or other position obviating specific elevation requirementa The refrigeration heat reclaim unit can be pre-engineered, pre-fabricated, and packaged with fixed capacities, allowing for an expedient and inexpensive deployment ascompared to conventional systems. The packaged unit permitseconomiesof scaleto be applied to aspecific refrigeration system design, allowing for cost reductions in fabrication and instalIation aswelI as energy cost savinga

Also, the parallel massflow arrangement in accordancewith some embodiments does not require asignificant additional refrigerant charge. Therefore, liquid refrigerant management in ambient extremes is not affected beyond existing system requirementa Only the required refrigerant massfIow needed to satisfy a current heating demand isallowed to pass into the reelaim heat exchanger 20. All remaining massfIow isdirected to theair cooled condenser 14. Thetwo heat exchanger outlet liquid streams, namely, the condenser and heat reclaim, are preferably returned to the liquid receiver 15 separately. The parallel massflow arrangement operatescompletely transparent to the existing refrigeration system, and requires Iesstotal refrigerant chargethan a conventional seriesfIow arrangement.

FlG.4 isafIow diagram i11ustrating a method 200 for controlIing afIow of refrigerant between a reelaim heat exchanger and a condenser, in accordancewith someembodiments. In describing the method 200, reference is madeto elementsof the refrigeration cycle i11ustrated at FIGa 1-3.

Another featureof a parallel massflow arrangement in accordancewith some embodiments isthe presence of the controlIer 40, which can providean integral heat balance between the air- cooled condenser 14 and the reclaim heat exchanger 20. Accordingly, in some embodiments, some or all of the method 200 is implemented and executed by thecontroller 40.

At block 202, atemperature of thefIuid refrigerant at the outlet 106 of the heat exchanger 20 is measured by a sensor 109 or theIike. Similarly, a refrigerant pressure can also be measured by a sensor 109 or the Iikeat the outlet 106 of the heat exchanger 20. Oneor moretemperature and/or pressure sensors or the Iike can be positioned between theoutlet 106 and the liquid receiver 15. Other sensors may be positioned at other relevant locations, for example, between the refrigerant outlet 134 and the redaim heat exchanger inlet 108, for measuring fIuid temperature and/or pressure attheinlet 108. A check valve 111 can also beat theoutlet 106 that performsor otherwise establishesa pressure balance between reelaim heat exchanger outlet 106 and air-cooled condenser outlet such that both paths of refrigerant massflow heat exchange maintain an equal or common pressure at liquid receiver 15.

At block 204, the measured temperature and pressureat the heat exchanger outlet 106 are compared to a reference pressure-temperature (FT) setpoint for atarget condition at the refrigerant outlet 106 that correspondsto a refrigerant quality (x) valueof zero (x=0). Thesetpoint valuesare spedfic to thetype of refrigerant which is used and iswelI-known to oneor ordinary ski11 in theart, for example, Forane® 407A refrigerant, and for atarget saturated condensing temperature (SCT), for example, shown in FIG.5. Thecontrolling of thequality position, i.e, x=0, allows maximum heat exchanger effectivenesswhile ensuring that a liquid stateexistsat theoutlet 106 to mergewith the liquid refrigerant output from the air-cooled condenser 14 to the liquid receiver 15.

At block 206, the refrigerant fIow control device 30 is modulated by thecontrolIer 40 in responsetothe comparison between the measured temperatureand pressureat the heat exchanger outlet 106 and the reference FT setpoint. For example, the controlIer 40 modulatesor Iinearly opens or closesthe refrigerant fIow control device 30 such that the measured temperatureand pressure conditionscorrespond with thetarget saturated condensing temperature and pressureconditions For example, asshown in FIG.5, an increase in a measured pressure and/or temperature above theSCT target at theoutlet 106 may occur. Here, thecontrolIer 40 can modulatethefIow control device 30, for example, modulatetoward aclose position, until the measured pressure decreasesto equal the reference pressurefor the reference SCT value, for example, 70 degrees F shown in FIG.5. Similarly, a decreasein a measured pressure and/or temperature below the SCT target at the outlet 106 may occur. Here, thecontrolIer 40 can modulatethefIow control device30, for example, open position, until the measured temperature increasesto equal the reference temperaturefor the reference SCT value

I n someembodiments, the controlIer 40 can perform other fundions, someor alI of which can be part of acontrol sequence For example, the controlIer 40 can activateor inactivatea pump at the heat exchanger 20 with respect to afIuid fIow through the heat exchanger 20 if an outside temperaturefalIsabove or be!ow an activecontrol setpoint temperature indicating or creating a heat demand situation whereby the redaim heat exchanger 20 may provide alI or a portion of the heat to offset or satisfy the heat demand. For example, outsidetemperatures below asetpoint may indicate that heat is needed to satisfy an outsideair ventilation demand in an occupied building, for example the outsideair heating Ioad providesa heat rejection cooling capadty for redaim heat exchanger 20, for example refrigerant massflow control device 30, may direct a proportion of the refrigerant mass flow to redaim heat exchanger inlet 108, for example, superheated refrigerant massflow at inlet 108 may exchangeor transfer heat to redaim fIuid fIow at outlet 102 to offset or satisfy outsideair ventilation heating demand .

Thecontroller can, under certain conditions, energizethe bypassdevice22 to bypass refrigerant massflow from the refrigerant flow control device 30 directly to the air cooled condenser 14 without going thru the refrigerant flow control device30. For example, when thecontroller 40 detectsa lossof flow viaafluid flow differential pressure switch, thecontroller 40 can open the bypass device22 allowing normal refrigerant flow to theair cooled condenser 14. If a determination is madethe measured pressure isgreater than a predetermined refrigerant high pressure limit, or the measured fluid temperature isgreater than a predetermined high temperature limit, for example, 90°F, thecontrolIer 40 can open the refrigerant bypassdevice22. SimiIarly, upon an unacceptable drop in pressureand/or temperature, thecontrolIer can closethe bypassdevice22.

Aswill beappreciated by one skilled in theart, concepts may beembodied asa device, system, method, or computer program product. Accordingly, aspects may taketheform of an entirely hardwareembodiment, an entirely software embodiment (including firmware, resident software, micro-code, etc.) or an embodiment combining softwareand hardware aspectsthat may alI generalIy be referred to herein asa"circuit," "module" or "system." Furthermore, aspects may take theform of acomputer program product embodied in oneor more computer readable medium(s) having computer readable program codeembodied thereon.

Computer program codefor carrying out operationsfor the conceptsmay bewritten in any combination of one or more programming Ianguages. The program code may executeentirely on the user'scomputer, partly on the user'scomputer, asa stand-alonesoftware package, partly on the user's computer and partly on a remote computer or entirely on the remotecomputer or server. In the latter scenario, the remotecomputer may beconnected to the user's computer through any type of network, including a local area network (LAN) or awide area network (WAN), or the connection may be madeto an external computer (for example, through the Internet using an Internet Service Frovider).

Conceptsare described herein with referenceto fIowchart i11ustrationsand/or block diagrams of methods, apparatus (systems) and computer program productsaccording to embodiments It wi11 be understood that each block of theflowchart illustrationsand/or block diagrams and combinations of blocks in theflowchart illustrationsand/or block diagrams can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purposecomputer, spedal purpose computer, or other programmable data processng apparatusto producea machine, such that the instructions which executeviathe processor of the computer or other programmabledata processing apparatus create meansfor implementing the functions/actsspecified in theflowchart and/or block diagram block or blocks

These computer program instructions may also bestored in a computer readable medium that can direct a computer, other programmabledata processing apparatus, or other devicesto fundion in a particular manner, such that the instructionsstored in the computer readable medium producean artideof manufacture induding instructionswhich implement thefundion/act specified in the flowchart and/or block diagram block or blocks.

Thecomputer program instrudions may also be loaded onto acomputer, other programmable data processing apparatus, doud-based infrestructure architecture, or other devicesto cause a series of operational stepsto be performed on thecomputer, other programmableapparatusor other devices to producea computer implemented processsuch that the instructionswhich executeon the computer or other programmableapparatus provide processesfor implementing thefunctions/acts specified in theflowchart and/or block diagram block or blocks.

ThefIowchart and block diagrams in the Figures i11ustratethearchitecture, functionality, and operation of possible implementationsof systems, methodsand computer program products according to various embodiments. In this regard, each block in thefIowchart or block diagrams may represent a module, segment, or portion of code, which comprisesoneor moreexecutable instructionsfor implementing the specified logical function(s). It should also be noted that, in some alternative implementations, thefundions noted in the block may occur out of theorder noted in the figures. For example, two blocksshown in succession may, in fact, beexecuted substantially concurrent!y, or the blocks may sometimesbe executed in the reverseorder, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart i11ustration, and combinationsof blocks in the block diagramsand/or fIowchart i11ustration, can be implemented by spedal purpose hardware-based systemsthat perform thespedfied fundionsor ads, or combinationsof special purpose hardwareand computer instrudions.

Whileconcepts have been shown and described with referenceto spedfic preferred embodiments, it should be understood by thoseski11ed in theart that variouschanges in form and detaiI may be madetherein without departing from thespirit and scopeasdefined by thefolIowing daima