REINFORCING FIBERS AND MOLDED BODY USING SAME

Title:

REINFORCING FIBERS AND MOLDED BODY USING SAME

Document Type and Number:

WIPO Patent Application WO/2022/044460

Kind Code:

A1

Abstract:

Provided are: reinforcing fibers exhibiting excellent adhesiveness to rubber without the need to use resorcinol, formaldehyde or an epoxy compound; and a molded body that uses the same.　The reinforcing fibers are characterized: by comprising fibers, a surface-modifying layer for coating at least a portion of the surface of the fibers, and an adhesive layer that contains a conjugated diene rubber and covers at least a portion of the surface-modifying layer; and in that the surface-modifying layer has a weight-average molecular weight (Mw) of 300 or greater and contains a polyamine compound that has one or more functional groups selected from imino groups and primary to tertiary amine groups.

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Inventors:

ISHIDA EIICHI (JP)
CHO TETSUYUKI (JP)
TAKEMOTO SHINICHI (JP)
ASADA TORU (JP)
TANAKA JIRO (JP)

Application Number:

PCT/JP2021/020032

Publication Date:

March 03, 2022

Filing Date:

May 26, 2021

Export Citation:

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Assignee:

KURARAY CO (JP)

International Classes:

D06M15/61; C08J5/06; D06M13/332; D06M15/693

Domestic Patent References:

WO2019230700A1

2019-12-05

Foreign References:

JPS4017131B1	1965-08-04
JPS4927440B1	1974-07-17
JPS60209071A	1985-10-21
EP3258006A1	2017-12-20

Attorney, Agent or Firm:

OHTANI PATENT OFFICE (JP)

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