Title:
REINFORCING-PLATE-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/014043
Kind Code:
A1
Abstract:
The present invention provides a reinforcing-plate-integrated flexible printed circuit board that does not peel away from the reinforcing plate during reflow soldering, and has excellent reliability in terms of electrical insulation. The reinforcing-plate-integrated flexible printed circuit board is composed of, in order, (A) the reinforcing plate, (B) a thermosetting adhesive, (C) an insulating film, and (D) a film with a wiring pattern, and is characterized in that the (C) insulating film contains at least (a) a binder polymer, and (b) a black colorant having a reflective region in an infrared region.
Inventors:
KIDO MASAYOSHI (JP)
SEKITO YOSHIHIDE (JP)
SEKITO YOSHIHIDE (JP)
Application Number:
PCT/JP2013/069478
Publication Date:
January 23, 2014
Filing Date:
July 18, 2013
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
H05K1/02; C09D5/33; C09D7/61; C09D201/00; G03F7/004; H05K3/28
Domestic Patent References:
| WO2012035857A1 | 2012-03-22 |
Foreign References:
| JP2002294131A | 2002-10-09 | |||
| JP2010013558A | 2010-01-21 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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