Title:
RELEASE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/186953
Kind Code:
A1
Abstract:
Provided is a release sheet configured: such that a release layer does not separate from a protective layer as a result of processing, such as cutting, conducted before hot pressing; and such that the release layer can easily be separated from the protective layer after the hot pressing. This release sheet includes a substrate and a release layer formed on the substrate. The release layer is formed from a release agent composition that includes: a silicone-modified alkyd resin (A); a crosslinking agent (B); and a polybutadiene (C) having a crosslinking functional group that reacts with the crosslinking agent (B). The content of the polybutadiene (C) in the release agent composition is 20-70 parts by mass with respect to 100 parts by mass in total of the silicone-modified alkyd resin (A), the crosslinking agent (B), and the polybutadiene (C).
Inventors:
FURUNO EMIKO (JP)
YOSHIDA TAKANORI (JP)
YOSHIDA TAKANORI (JP)
Application Number:
PCT/JP2021/004713
Publication Date:
September 23, 2021
Filing Date:
February 09, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; C08K5/3492; C08L47/00; C08L67/00; C09D5/20; C09D7/61; C09D7/65; C09D109/00; C09D167/00
Domestic Patent References:
| WO2015087885A1 | 2015-06-18 |
Foreign References:
| JP2019171617A | 2019-10-10 | |||
| JP2017217838A | 2017-12-14 | |||
| JP2017177434A | 2017-10-05 | |||
| JP2019127666A | 2019-08-01 | |||
| JP2009131977A | 2009-06-18 | |||
| JP2019093686A | 2019-06-20 | |||
| JP2003181594A | 2003-07-02 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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