Title:
REPAIR TAPE, AND MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR SAID REPAIR TAPE
Document Type and Number:
WIPO Patent Application WO/2022/264560
Kind Code:
A1
Abstract:
The present invention is repair tape used to repair LED chips installed in a micro LED display, the repair tape comprising: an elongated first tape material 2 which can be wound into a roll shape and has, on one surface thereof, an adhesive layer 22 to be adhered to LED chips 3; an elongated second tape material 4 which can be wound into a roll shape and has, on one surface thereof, an adhesive layer 42 having stronger adhesion than the adhesive layer 22 of the first tape material 2; and the LED chips 3, which are interposed between the first tape material 2 and the second tape material 4, and are disposed according to a predetermined arrangement, wherein electrode surfaces of the LED chips 3 are adhered to the adhesive layer of the first tape material, and light emitting surfaces of the LED chips 3 are adhered to the adhesive layer 42 of the second tape material 4. This configuration makes it possible to easily repair the LED chips.
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Inventors:
OKURA NAOYA (JP)
Application Number:
PCT/JP2022/010702
Publication Date:
December 22, 2022
Filing Date:
March 10, 2022
Export Citation:
Assignee:
V TECH CO LTD (JP)
International Classes:
C09J201/00; C09J7/38; G09F9/00; H01L33/48
Foreign References:
| JP2020064118A | 2020-04-23 | |||
| JP2020117708A | 2020-08-06 | |||
| JP2016027136A | 2016-02-18 | |||
| JP2021148868A | 2021-09-27 |
Attorney, Agent or Firm:
OGAWA, Moriaki et al. (JP)
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