Title:
RESIN-COATED METAL FOIL, PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/074646
Kind Code:
A1
Abstract:
The present invention relates to a resin-coated metal foil that has a first thermosetting resin layer containing an inorganic filler, a second thermosetting resin layer containing a rubber component, and a metal foil in this order, the content of the inorganic filler in the first thermosetting resin layer being 50-90% by mass, and the content of the inorganic filler in the second thermosetting resin layer being 0-20% by mass, and also relates to a printed wiring board using the resin-coated metal foil, a manufacturing method thereof, and a semiconductor package.
Inventors:
SASAKI KAORI (JP)
HIDAKA YOSHIKI (JP)
SOMEKAWA JUNKI (JP)
TABATA SHIORI (JP)
NAKAMURA YUKIO (JP)
SHINOZAKI HARUKA (JP)
HIROSE TSUYOSHI (JP)
HIDAKA YOSHIKI (JP)
SOMEKAWA JUNKI (JP)
TABATA SHIORI (JP)
NAKAMURA YUKIO (JP)
SHINOZAKI HARUKA (JP)
HIROSE TSUYOSHI (JP)
Application Number:
PCT/JP2022/039600
Publication Date:
May 04, 2023
Filing Date:
October 25, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
B32B15/08; B32B15/088; C08K3/013; C08L101/00; H05K1/03
Domestic Patent References:
| WO2017175614A1 | 2017-10-12 | |||
| WO2017130947A1 | 2017-08-03 | |||
| WO2021132495A1 | 2021-07-01 | |||
| WO2016117282A1 | 2016-07-28 | |||
| WO2003009655A1 | 2003-01-30 |
Foreign References:
| JPH07232405A | 1995-09-05 | |||
| JP2017193693A | 2017-10-26 | |||
| US20190203003A1 | 2019-07-04 | |||
| JPH07214725A | 1995-08-15 | |||
| US20160150644A1 | 2016-05-26 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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