Title:
RESIN COMPONENT, AND MOLDING METHOD AND MOLDING DEVICE FOR SAME
Document Type and Number:
WIPO Patent Application WO/2018/061906
Kind Code:
A1
Abstract:
An instrument panel 10 is obtained by bonding a base material part 20 made from a base material M1 and a different material part 30 made from a different material M2. The different material part 30 is inserted into the base material 20, and this insertion part 33 has a plurality of discontinuous recesses.
Inventors:
MORIIZUMI TAIKI (JP)
KAMI YUUKI (JP)
HIRANO NOBORU (JP)
SAIMURA TOSHIHIRO (JP)
MIYAMOTO HAJIME (JP)
YUSA ATSUSHI (JP)
KAWANO KAZUHIRO (JP)
KAMI YUUKI (JP)
HIRANO NOBORU (JP)
SAIMURA TOSHIHIRO (JP)
MIYAMOTO HAJIME (JP)
YUSA ATSUSHI (JP)
KAWANO KAZUHIRO (JP)
Application Number:
PCT/JP2017/033828
Publication Date:
April 05, 2018
Filing Date:
September 20, 2017
Export Citation:
Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B60K37/00; B60R21/215
Foreign References:
| JP2004001424A | 2004-01-08 | |||
| JP2009535247A | 2009-10-01 | |||
| JPH1148284A | 1999-02-23 | |||
| JPH05104575A | 1993-04-27 | |||
| JPH04334416A | 1992-11-20 | |||
| JPH05208428A | 1993-08-20 | |||
| US20100013124A1 | 2010-01-21 |
Attorney, Agent or Firm:
SATO & ASSOCIATES (JP)
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