Title:
RESIN COMPOSITION FOR 3D PRINTING DEVICE, FILAMENT FOR 3D PRINTING DEVICE, FABRICATED OBJECT, AND PELLET FOR 3D PRINTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/062693
Kind Code:
A1
Abstract:
Provided are: a resin composition for a 3D printing device that can improve both adhesiveness to, e.g., a stage of a 3D printing device and formability during fabrication; and a corresponding filament for the 3D printing device, fabricated object, and pellet for the 3D printing device This resin composition for a 3D printing device comprises (A) a thermoplastic resin and (B) a polymer having a reactive group and a non-polar polymer molecular chain, wherein the weight average molecular weight of the (A) thermoplastic resin is higher than the weight average molecular weight of the (B) polymer having a reactive group and a non-polar polymer molecular chain and the content of the (B) polymer having a reactive group and a non-polar polymer molecular chain is greater than10.3 and less than 37 parts by mass with respect to 100 parts by mass of the (A) thermoplastic resin.
Inventors:
AKIYAMA YUKI (JP)
AOKI KENJI (JP)
AOKI KENJI (JP)
Application Number:
PCT/JP2023/021054
Publication Date:
March 28, 2024
Filing Date:
June 06, 2023
Export Citation:
Assignee:
JOTO TECHNO CO LTD (JP)
International Classes:
B33Y80/00; B29C64/118; B29C64/314; B33Y70/00
Domestic Patent References:
| WO2020138174A1 | 2020-07-02 |
Foreign References:
| JP2021154589A | 2021-10-07 | |||
| KR20200071817A | 2020-06-22 | |||
| CN114230925A | 2022-03-25 | |||
| CN110835441A | 2020-02-25 | |||
| JP2020192704A | 2020-12-03 | |||
| JP2020157609A | 2020-10-01 |
Attorney, Agent or Firm:
KON Satoshi (JP)
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