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Title:
RESIN COMPOSITION, ADHESIVE AGENT, AND COMPATIBILIZER
Document Type and Number:
WIPO Patent Application WO/2022/149574
Kind Code:
A1
Abstract:
A resin composition comprising: a modified hydrogenated product (A) of a block copolymer including a polymeric block (A-1) that has a structural unit derived from an aromatic vinyl compound and a polymeric block (A-2) that has a structural unit derived form a conjugated diene compound; and a polyolefin-based resin (B), wherein the modified hydrogenated product (A) has one or more functional groups selected from alkoxysilyl groups, carboxy group, amino group, hydroxy group, epoxy group, and groups derived from acid anhydrides, and the vinyl bonding amount of the polymeric block (A-2) is 50-99 mol%. A resin composition additionally comprising a polar resin (C).

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Inventors:
KATO MASAHIRO (JP)
SENDA YASUSHI (JP)
SATANI RYO (JP)
Application Number:
PCT/JP2022/000074
Publication Date:
July 14, 2022
Filing Date:
January 05, 2022
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
C08L23/00; C08F8/04; C08F297/04; C08L53/02; C09J123/00; C09J153/02
Foreign References:
JP2020189917A2020-11-26
JP2021181561A2021-11-25
JPH0337287A1991-02-18
JPH10279774A1998-10-20
JPS63254119A1988-10-20
JP2005015528A2005-01-20
JP2011132298A2011-07-07
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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