RESIN COMPOSITION FOR ADHESIVE AGENT, ADHESIVE AGENT COMPRISING THE RESIN COMPOSITION, ADHESIVE SHEET, AND PRINTED WIRING BOARD INVOLVING THE ADHESIVE SHEET AS ADHESIVE LAYER

WIPO Patent Application WO/2011/129278

A1

Disclosed is a resin composition for an adhesive agent, which comprises: a thermoplastic resin (A1) comprising a polyester resin or a polyurethane resin and having an acid value (unit: equivalent/106 g) of 100 to 1000 inclusive, a glass transition temperature of 30 to 80˚C inclusive and a number average molecular weight of 5.0×103 to 1.0×105 inclusive; a thermoplastic resin (A2) comprising a polyester resin or a polyurethane resin and having a glass transition temperature of 0°C or lower and a number average molecular weight of 5.0×103 to 1.0×105 inclusive; an inorganic filler (B); and an epoxy resin (D) having a dicyclopentadiene backbone. In a cured coating film which is produced by drying the resin composition at 130°C for 3 minutes and heating the dried product at 140°C for 4 hours, at least the thermoplastic resin (A1) and at least a part of the thermoplastic resin (A2) have phase-separated structures.

NANBARA SHINTARO (JP)
ASADA HIROKO (JP)
ITO TAKESHI (JP)

PCT/JP2011/058902

October 20, 2011

April 08, 2011

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TOYO BOSEKI (JP)
NANBARA SHINTARO (JP)
ASADA HIROKO (JP)
ITO TAKESHI (JP)

C09J167/00; C09J7/00; C09J11/04; C09J163/10; C09J175/04; H01L21/60; H05K1/03

WO2010038733A1	2010-04-08
WO2010035822A1	2010-04-01

JP2010084005A	2010-04-15
JP2005170999A	2005-06-30
JP2008260831A	2008-10-30
JP2007204715A	2007-08-16
JP2008019375A	2008-01-31
JP2009084348A	2009-04-23

Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)

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