Title:
RESIN COMPOSITION, ADHESIVE OR ENCAPSULATION MATERIAL, CURED OBJECT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/181831
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a low-temperature-curable resin composition and an adhesive which are able to be inhibited from suffering bleeding. Provided is a resin composition comprising (A) an epoxy compound, (B) a polythiol compound, (C) a cyclic carbodiimide compound, and (D) a curing catalyst.
Inventors:
FUKAZAWA ERI (JP)
IWAYA KAZUKI (JP)
ABE NOBUYUKI (JP)
IWAYA KAZUKI (JP)
ABE NOBUYUKI (JP)
Application Number:
PCT/JP2023/007785
Publication Date:
September 28, 2023
Filing Date:
March 02, 2023
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08G59/66; C08K5/34; C08L63/00; C09J163/00; C09K3/10; H01L23/29; H01L23/31
Domestic Patent References:
| WO2016039486A1 | 2016-03-17 | |||
| WO2023276773A1 | 2023-01-05 | |||
| WO2019138919A1 | 2019-07-18 |
Foreign References:
| JP2022026245A | 2022-02-10 | |||
| JP2017125150A | 2017-07-20 | |||
| JP2023030721A | 2023-03-08 | |||
| JP2019123825A | 2019-07-25 | |||
| JP2020132646A | 2020-08-31 | |||
| CN104774584A | 2015-07-15 | |||
| CN109536098A | 2019-03-29 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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