RESIN COMPOSITION, ADHESIVE, ENCAPSULATION MATERIAL, CURED OBJECT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT

Title:

RESIN COMPOSITION, ADHESIVE, ENCAPSULATION MATERIAL, CURED OBJECT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2023/181845

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a resin composition and an adhesive which are curable at least thermally and can be inhibited from suffering bleeding.　Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a polythiol compound, (C) a curing catalyst, and (D) zeolite particles.

Inventors:

MITSUNUSHI KOKI (JP)

Application Number:

PCT/JP2023/008002

Publication Date:

September 28, 2023

Filing Date:

March 03, 2023

Export Citation:

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Assignee:

NAMICS CORP (JP)

International Classes:

C08G75/02; C08L81/02; C09J4/02; C09J11/00; C09J11/04; C09J11/06; C09J11/08; C09J181/02; H01L23/10

Foreign References:

JP2020100795A	2020-07-02
JP2020102430A	2020-07-02
JP2019031642A	2019-02-28
JP2021512192A	2021-05-13
JP2011137104A	2011-07-14
JP2015071548A	2015-04-16

Attorney, Agent or Firm:

TSUKUNI & ASSOCIATES et al. (JP)

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