Title:
RESIN COMPOSITION, ADHESIVE FILM, BONDING SHEET FOR INTERLAYER ADHESION, AND RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE WITH ANTENNA
Document Type and Number:
WIPO Patent Application WO/2024/048055
Kind Code:
A1
Abstract:
Provided is a resin composition having excellent solder heat resistance and low dielectric properties. The resin composition contains (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at an end and (B) a thermoplastic elastomer having a number average molecular weight of 60,000 or more.
Inventors:
USAMI RYO (JP)
TAKASUGI HIROSHI (JP)
TAKASUGI HIROSHI (JP)
Application Number:
PCT/JP2023/024266
Publication Date:
March 07, 2024
Filing Date:
June 29, 2023
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08F299/02; C08L53/02; C08L63/00; C08L71/12; C09J7/35; C09J153/02; C09J171/12; H05K3/46
Domestic Patent References:
| WO2019230531A1 | 2019-12-05 | |||
| WO2020096036A1 | 2020-05-14 | |||
| WO2021024364A1 | 2021-02-11 | |||
| WO2019151014A1 | 2019-08-08 |
Foreign References:
| JP2022026390A | 2022-02-10 | |||
| JP2016027131A | 2016-02-18 | |||
| JP2016079354A | 2016-05-16 | |||
| JP2017125174A | 2017-07-20 | |||
| JP2015034195A | 2015-02-19 | |||
| JP2016033189A | 2016-03-10 | |||
| JP2020143264A | 2020-09-10 | |||
| JP2020007451A | 2020-01-16 |
Attorney, Agent or Firm:
WATANABE Kazuhira (JP)
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