Title:
RESIN COMPOSITION AND ADHESIVE FILM AND COVER FILM COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2022/141817
Kind Code:
A1
Abstract:
The present invention provides a resin composition and an adhesive film and a cover film comprising same. The resin composition comprises the following components in parts by weight: 40-80 parts of a polyamide imide resin, 10-40 parts of an epoxy resin, 5-30 parts of a phenoxy resin, and 5-20 parts of a phosphorus-containing flame retardant. By means of the screening and synergistic compounding of the components, the glass transition temperature and heat resistance of the resin composition are significantly improved, and at the same time, the resin composition has excellent adhesion performance and flame retardancy. The adhesive film and the cover film comprising the resin composition both have a glass transition temperature reaching above 160 °C, have outstanding heat resistance, stability and reliability, a high peel strength, good adhesion properties and flame retardancy, can fully meets processing and application requirements of flexible circuit substrates, and are especially suitable for preparing flexible copper clad laminates and flexible printed circuit boards having high temperature resistance and high reliability.
Inventors:
WANG QING (CN)
Application Number:
PCT/CN2021/081802
Publication Date:
July 07, 2022
Filing Date:
March 19, 2021
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C09J179/08; C08K5/49; C08L63/00; C08L71/12; C08L79/08; C09J7/30; C09J163/00; C09J171/12; H05K1/02
Foreign References:
| JP2010260974A | 2010-11-18 | |||
| JP2010037489A | 2010-02-18 | |||
| CN109096979A | 2018-12-28 | |||
| CN109233724A | 2019-01-18 | |||
| CN102047774A | 2011-05-04 | |||
| CN107793702A | 2018-03-13 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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