Title:
RESIN COMPOSITION, ADHESIVE FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/152134
Kind Code:
A1
Abstract:
To provide a resin composition having excellent thermal conductivity, adhesion, and film molding properties, and particularly a resin composition having excellent thermal conductivity after curing. A resin composition characterized by including (A) an aminophenol-type epoxy resin, (B) at least one species selected from the group consisting of phenoxy resins and thermoplastic elastomers, and (C) an inorganic filler having high thermal conductivity, the content of the (B) component being 0.5-5 parts by mass with respect to 1 part by mass of the (A) component. The glass transition temperature of the (B) component is preferably less than 50°C.
More Like This:
| JP2022089099 | CURABLE COMPOSITION, CURED PRODUCT, AND COMPOUND |
| JPH05112629 | EPOXY RESIN COMPOSITION |
| JP2017082157 | PHOTOCATIONIC CURABLE RESIN COMPOSITION AND SLIDE MEMBER |
Inventors:
TAKASUGI HIROSHI (JP)
KUROKAWA TSUYOSHI (JP)
TOSHIMA JUN (JP)
AOKI ISSEI (JP)
TERAKI SHIN (JP)
KUROKAWA TSUYOSHI (JP)
TOSHIMA JUN (JP)
AOKI ISSEI (JP)
TERAKI SHIN (JP)
Application Number:
PCT/JP2015/059873
Publication Date:
October 08, 2015
Filing Date:
March 30, 2015
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08G59/32; C08K3/00; C08L63/00; C08L71/10; C08L101/00; C09J7/00; C09J163/00; C09J171/10
Foreign References:
| JP2005187508A | 2005-07-14 | |||
| JP2011168672A | 2011-09-01 | |||
| JP2012079880A | 2012-04-19 | |||
| JPH0782392A | 1995-03-28 |
Attorney, Agent or Firm:
WATARAI YUSUKE (JP)
Yuusuke Watarai (JP)
Yuusuke Watarai (JP)
Download PDF: