Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION, ADHESIVE COMPOSITION, LAYERED PRODUCT WITH ADHESIVE LAYER, COVERLAY FILM, BONDING SHEET, ELECTROMAGNETIC WAVE SHIELDING MATERIAL, COMPOSITE MATERIAL, POLYURETHANE, AND COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/101068
Kind Code:
A1
Abstract:
This resin composition contains: a polyurethane resin (A) that contains a poly(phenylene ether) having at least two hydroxyl groups in the molecule and a polyisocyanate in a polymer component; and an epoxy resin (B). The polyurethane contains a poly(phenylene ether) having at least two hydroxyl groups in the molecule and a polyisocyanate in a polymer component.

Inventors:
SASAKI IKUO (JP)
TORII MASAHIRO (JP)
ANDO MASARU (JP)
TAKAGI AKIRA (JP)
HIRAKAWA MAKOTO (JP)
Application Number:
PCT/JP2023/037109
Publication Date:
May 16, 2024
Filing Date:
October 12, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C08G18/48; B32B27/40; C08G18/32; C08L63/00; C08L75/08; C09J7/35; C09J9/02; C09J11/04; C09J163/00; C09J175/08
Foreign References:
CN107880530A2018-04-06
JP2019099583A2019-06-24
JP2018123269A2018-08-09
JP2016204567A2016-12-08
JP2016524023A2016-08-12
CN114409891A2022-04-29
JP2019196458A2019-11-14
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF: