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Title:
RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC PARTS
Document Type and Number:
WIPO Patent Application WO/2023/167014
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition and an adhesive with which a cured material, in which unreacted residues are suppressed after thermal curing following UV curing, can be obtained.　Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a polyfunctional thiol compound, (C) a photoradical polymerization initiator, and (D) a thermal curing accelerator containing an azabicyclo ring compound having bridgehead nitrogen.

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Inventors:
OTSUBO KODAI (JP)
SUZUKI FUMIYA (JP)
Application Number:
PCT/JP2023/005708
Publication Date:
September 07, 2023
Filing Date:
February 17, 2023
Export Citation:
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Assignee:
NAMICS CORP (JP)
International Classes:
C08G75/045; C08G59/50; C09J4/02; C09J11/06
Domestic Patent References:
WO2009014112A12009-01-29
WO2016117292A12016-07-28
Foreign References:
JP2016501969A2016-01-21
JP2013241558A2013-12-05
JP2018501356A2018-01-18
JP2010077327A2010-04-08
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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