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Title:
RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/090259
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a resin composition which has excellent reactivity and from which a cured product having excellent stress relaxation properties is formed; and an adhesive.　Provided is a resin composition comprising: (A) a polyfunctional epoxy compound having an epoxy equivalent of less than 215 g/eq; (B) a polyfunctional epoxy compound having an epoxy equivalent of at least 215 g/eq; (C) a polyfunctional thiol compound; (D) a curing catalyst; and (E) a monofunctional compound having one group (e), which includes an unsaturated double bond and an electron-withdrawing group adjacent thereto, in a molecule.

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Inventors:
MEGURO KENTO (JP)
SAITO ATSUSHI (JP)
Application Number:
PCT/JP2023/037344
Publication Date:
May 02, 2024
Filing Date:
October 16, 2023
Export Citation:
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Assignee:
NAMICS CORP (JP)
International Classes:
C08G59/66; C09J4/02; C09J4/06; C09J11/06; C09J163/00
Domestic Patent References:
WO2022210261A12022-10-06
WO2021033325A12021-02-25
WO2021033329A12021-02-25
WO2021033327A12021-02-25
Foreign References:
JP2019156965A2019-09-19
JP2008001867A2008-01-10
JP2021075698A2021-05-20
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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