Title:
RESIN COMPOSITION, ADHESIVES PREPARED THEREWITH FOR BONDING CIRCUIT MEMBERS, AND CIRCUIT BOARDS
Document Type and Number:
WIPO Patent Application WO/2001/059007
Kind Code:
A1
Abstract:
The invention relates to a resin composition giving lowly hygroscopic molded articles; adhesives for bonding circuit members, prepared by using the composition; and circuit boards. The composition is characterized by comprising a polyhydroxyated polyether (A) represented by the general formula (I) or (II) and a resin (B) crosslinkable in three dimensions. In formula (I), [wherein R?1¿ to R?8¿ are each H, C¿1-4? alkyl, C¿2-5? alkenyl, C¿1-4? hydroxyalkyl, or halogeno; R¿a? is H or C¿1-2? alkyl; R¿b? is C¿2-13? alkyl; and n is a number of repetitions, and in formula (II), [wherein R?9¿ to R?12¿ are each H, C¿1-6? alkyl, C¿1-6? hydroxyalkyl, or halogeno; R¿c? to R¿f? are each H, C¿1-6? alkyl, cyclohexyl, aryl, aralkyl, or halogeno; and m is a number of repetitions.
Inventors:
OOTA SATORU (JP)
YUSA MASAMI (JP)
NAGAI AKIRA (JP)
YUSA MASAMI (JP)
NAGAI AKIRA (JP)
Application Number:
PCT/JP2001/000906
Publication Date:
August 16, 2001
Filing Date:
February 09, 2001
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
OTA SATORU (JP)
YUSA MASAMI (JP)
NAGAI AKIRA (JP)
OTA SATORU (JP)
YUSA MASAMI (JP)
NAGAI AKIRA (JP)
International Classes:
C08F283/06; C08L71/00; C08L71/10; C09J4/06; C09J171/00; H05K3/32; H05K3/38; H05K3/46; (IPC1-7): C08L71/10; C08L63/00; C09J4/06; C09J7/00; C09J9/02; C09J163/00; C09J171/00; H01B1/20; H01L21/60; H05K3/32
Domestic Patent References:
| WO1998015597A1 | 1998-04-16 |
Foreign References:
| JPH10120761A | 1998-05-12 | |||
| JPH10120753A | 1998-05-12 | |||
| JPS6279224A | 1987-04-11 |
Attorney, Agent or Firm:
Tsukuni, Hajime (Toranomon 1-chome Minato-ku Tokyo, JP)
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