Title:
RESIN COMPOSITION FOR BOND MAGNET AND BOND MAGNET FORMED BODY FORMED USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/057888
Kind Code:
A1
Abstract:
According to one aspect of the present disclosure, it is possible to provide: a resin composition for a bond magnet that excels in physical characteristics such as heat resistance, bending strength, and IZOD impact strength without reduction of a magnetic characteristic, and that has a low water absorption rate; and a bond magnet formed body formed using said resin composition. The resin composition for a bond magnet includes at least magnetic powder and a binder resin, contains 70 wt% or greater of the magnetic powder, and contains 5-30 wt% of a resin having a PA10 skeleton as the binder resin.
Inventors:
SAKURAI HIROMITSU (JP)
HINO MAKOTO (JP)
KATAYAMA NOBUHIRO (JP)
HINO MAKOTO (JP)
KATAYAMA NOBUHIRO (JP)
Application Number:
PCT/JP2023/030855
Publication Date:
March 21, 2024
Filing Date:
August 28, 2023
Export Citation:
Assignee:
TODA KOGYO CORP (JP)
International Classes:
H01F1/08; H01F1/053; H01F1/113; H01F7/02
Foreign References:
| JP2001057304A | 2001-02-27 | |||
| JP2005162802A | 2005-06-23 | |||
| JP2013077802A | 2013-04-25 | |||
| JP2007003223A | 2007-01-11 | |||
| JP2000114031A | 2000-04-21 | |||
| JPH0997709A | 1997-04-08 |
Attorney, Agent or Firm:
OKUMACHI Tetsuyuki (JP)
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