RESIN COMPOSITION FOR BONDING METAL, PRODUCT FORMED BY BONDING METAL WITH RESIN COMPOSITION, AND MANUFACTURING METHOD

WIPO Patent Application WO/2018/121493

A1

The present invention provides a resin composition for bonding metal, a product formed by bonding metal with the resin composition, and a manufacturing method. The composition mainly consists of: a component (I) (which is at least one selected from polyether ketone, polyether ether ketone, or polyether ketone ketone); a component (II) (which is polyphenylene sulfide); a component (III) (which is at least one selected from polyetherimide, polyimide, polyamideimide, or polysulfone resin) which is added according to needs; and (IV) an inorganic filler. The composition is obtained by means of corresponding melt-mixing in a known melt mixer such as a single-screw or twin-screw extruder, a Banbury mixer, a kneader, and a mixer. The resin composition for bonding metal in the present invention has an excellent metal bonding property, and is suitable for use in motor vehicle parts and electronic products, such as laptop computers and mobile phones, that need metal bonding.

QI XINGCHAO (CN)
ZHENG DAPENG (CN)
TANG XIANWEN (CN)
KATO KOYA (CN)
MATSUDA MASASHI (CN)
ZHANG XINPU (CN)

PCT/CN2017/118442

July 05, 2018

December 26, 2017

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TORAY ADVANCED MATERIALS RES LABORATORIES CHINA CO LTD (CN)

C08J5/12; C08L71/00; C08L81/02

WO2016092087A1

2016-06-16

CN101668814A	2010-03-10
CN103329209A	2013-09-25
CN1675308A	2005-09-28
CN1030433A	1989-01-18
KR0119913B1	1997-10-17

KING & WOOD MALLESONS (CN)

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