Title:
RESIN COMPOSITION, RESIN COMPOSITION COATING, RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/148996
Kind Code:
A1
Abstract:
Provided are a resin composition that enables fine pattern processing even on a rough-surfaced substrate made of a ceramic or the like, a resin composition film, and a semiconductor device in which these are used. A resin composition containing (A) a cationic polymerizable compound and (B) a photocationic polymerization initiator, wherein the resin composition is characterized by furthermore containing (C) a sensitizer.
Inventors:
MATSUMURA KAZUYUKI (JP)
KATO KEIGO (JP)
TATEOKA YOSHIKO (JP)
SHIMADA AKIRA (JP)
KATO KEIGO (JP)
TATEOKA YOSHIKO (JP)
SHIMADA AKIRA (JP)
Application Number:
PCT/JP2022/026932
Publication Date:
August 10, 2023
Filing Date:
July 07, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G59/68; C08L63/00; C08L79/08; G03F7/004; G03F7/038
Domestic Patent References:
| WO2018021049A1 | 2018-02-01 | |||
| WO2022019205A1 | 2022-01-27 | |||
| WO2021059843A1 | 2021-04-01 |
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