RESIN COMPOSITION, COATING MATERIALS CONTAINING THE SAME, COATING FILM AND PROCESS FOR FORMING THE FILM

Title:

RESIN COMPOSITION, COATING MATERIALS CONTAINING THE SAME, COATING FILM AND PROCESS FOR FORMING THE FILM

Document Type and Number:

WIPO Patent Application WO/2002/057357

Kind Code:

A1

Abstract:

A resin composition prepared by incorporating a photopolymerization initiator (d) into a solution (a) containing a modification of a thermoplastic resin (A), wherein the modification is one prepared either by polymerizing the resin (A) with a (co)polymer (B) composed of a copolymerizable monomer component (C) consisting of an $g(a),$g(b)-ethylenically mono- unsaturated monomer and, if necessary, other copolymerizable monomer in an organic solvent through radical formation, or by polymerizing the copolymerizable monomer component (C) in an organic solvent in the presence of the resin (A) and then subjecting the reaction mixture to polymerization through radical formation.

Inventors:

ASAMI KEIICHI (JP)
MURAKAMI TSUKASA (JP)
HASEGAWA YUGO (JP)

Application Number:

PCT/JP2002/000187

Publication Date:

July 25, 2002

Filing Date:

January 15, 2002

Export Citation:

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Assignee:

MITSUI CHEMICALS INC (JP)
ASAMI KEIICHI (JP)
MURAKAMI TSUKASA (JP)
HASEGAWA YUGO (JP)

International Classes:

C08F255/02; C08F257/02; C08L51/00; C08L51/06; C09D151/00; C09D151/04; C09D151/06; (IPC1-7): C08L51/04; C09D151/04

Foreign References:

JPS5456692A	1979-05-07
JPS4998454A	1974-09-18
US4299754A	1981-11-10

Other References: