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Patent Searching and Data


Title:
RESIN COMPOSITION FOR CONNECTOR, AND CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2017/018297
Kind Code:
A1
Abstract:
The present invention provides a resin composition for a connector, which exhibits excellent tracking resistance; and a connector obtained using the resin composition. This resin composition for a connector is obtained by blending 3-23 parts by mass of an ethylene-alkyl acrylate-glycidyl methacrylate copolymer relative to 100 parts by mass of poly(butylene terephthalate). The alkyl acrylate contained in the copolymer is preferably butyl acrylate. The resin composition for a connector may contain 10-20 parts by mass of glass fibers.

Inventors:
YAMASHITA TAKUYA (JP)
TAKATA YUTAKA (JP)
Application Number:
PCT/JP2016/071294
Publication Date:
February 02, 2017
Filing Date:
July 20, 2016
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01B3/42; C08K7/14; C08L33/14; C08L67/02; H01R13/46
Foreign References:
JP2006056997A2006-03-02
JP2009525385A2009-07-09
JPH04279657A1992-10-05
JPH0649337A1994-02-22
JP2001514699A2001-09-11
JP2000156950A2000-06-06
JP2001049095A2001-02-20
Attorney, Agent or Firm:
AICHI, TAKAHASHI, IWAKURA & ASSOCIATES (JP)
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