Title:
RESIN COMPOSITION, COPPER FOIL WITH RESIN, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/172759
Kind Code:
A1
Abstract:
Provided is a resin composition that demonstrates excellent dielectric properties, high adhesiveness to low-roughness surfaces, heat resistance, and excellent water resistance reliability. This resin composition includes an arylene ether compound with a weight average molecular weight of 30000 or greater, and a styrene copolymer that has, within the molecule, a reactive unsaturated bond demonstrating reactivity due to heat or UV light.
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| JPS6024828 | [Title of the Invention] Parting agent |
Inventors:
OOSAWA KAZUHIRO (JP)
TATEOKA AYUMU (TW)
OGAWA KUNIHARU (JP)
MAKINO HARUKA (JP)
TATEOKA AYUMU (TW)
OGAWA KUNIHARU (JP)
MAKINO HARUKA (JP)
Application Number:
PCT/JP2022/002966
Publication Date:
August 18, 2022
Filing Date:
January 26, 2022
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
C08F299/00; B32B15/08; C08L25/04; C08L71/12; H05K1/03
Domestic Patent References:
| WO2018181842A1 | 2018-10-04 | |||
| WO2016104748A1 | 2016-06-30 | |||
| WO2021065964A1 | 2021-04-08 |
Foreign References:
| JP2018523725A | 2018-08-23 | |||
| JP2018168347A | 2018-11-01 | |||
| JP2006083364A | 2006-03-30 | |||
| JP2020200427A | 2020-12-17 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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