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Title:
RESIN COMPOSITION, AND CURABLE FILM AND LAMINATED PLATE CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2023/027060
Kind Code:
A1
Abstract:
The present invention can provide a resin composition containing a phenylene ether resin and a petrolium resin. The phenylene ether resin is represented by general formula (1) [in general formula (1), X represents a unit including an aromatic ring, Y1 and Y2 may be identical or different from each other and each represent a phenylene group, Z1 and Z2 may be identical or different from each other and each represent a hydrogen atom or a unit including a polymerizable double bond-forming group, m and n each represent an integer of 0-300 but at least one of m and n is not 0]. In general formula (1), the ratio (%) of the number (A) [eq./g] of the polymerizable double bond-forming groups with respect to the number (B) [eq./g] of the hydroxyl groups is represented as (A)/(B)=95.0 to 99.5 / 0.5 to 5.0.

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Inventors:
ITO KOUTA (JP)
IIJIMA TAKAYUKI (JP)
MIYAMOTO MAKOTO (JP)
Application Number:
PCT/JP2022/031688
Publication Date:
March 02, 2023
Filing Date:
August 23, 2022
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08F299/02; B32B27/00; B32B27/30; C08F290/06
Foreign References:
CN104629341A2015-05-20
JPS63256650A1988-10-24
CN103937220A2014-07-23
JP2010024275A2010-02-04
JPS63251457A1988-10-18
JP2001152006A2001-06-05
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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