Title:
RESIN COMPOSITION, CURED ARTICLE, LAMINATE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/162687
Kind Code:
A1
Abstract:
Provided are: a resin composition having excellent storage stability and excellent chemical resistance of the resulting cured article; a cured article obtained by curing the resin composition; a laminate including the cured article; a method for producing a cured article; a method for producing a laminate; a method for producing a semiconductor device, which includes a method for producing a laminate; and a semiconductor device that includes a cured article or a laminate. The resin composition contains a resin and a metal complex having at least one π-conjugated site containing a nitrogen atom.
Inventors:
DAIKUHARA KENJI (JP)
AOSHIMA TOSHIHIDE (JP)
ASAKAWA DAISUKE (JP)
OOTA KAZUYA (JP)
AOSHIMA TOSHIHIDE (JP)
ASAKAWA DAISUKE (JP)
OOTA KAZUYA (JP)
Application Number:
PCT/JP2023/004117
Publication Date:
August 31, 2023
Filing Date:
February 08, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08F290/14; C08G73/10; C08K5/56; C08L79/08; C08L101/00; G03F7/027; G03F7/029; G03F7/031; G03F7/037; G03F7/20; G03F7/40; H01L21/312
Domestic Patent References:
| WO2021215133A1 | 2021-10-28 | |||
| WO2020241712A1 | 2020-12-03 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO et al. (JP)
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