Title:
RESIN COMPOSITION, CURED FILM, LAMINATE BODY, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/080217
Kind Code:
A1
Abstract:
This resin composition contains at least one type of resin selected from the group consisting of a polyimide precursor, polyimide, a polybenzoxazole precursor and polybenzoxazole, and a compound B with a pKa of greater than or equal to 5 and containing a group that generates a basic group by heating, and a group represented by formula (b1).
Formula (b1): -M(R1)(R2)(R3)
M represents Si, etc., R1-R3 independently represent Rb1 or ORb1, and Rb1 represents a hydrocarbon group with 1-10 hydrogens. A cured film using said resin composition, a laminate body, a cured film production method and a semiconductor device are also provided.
Inventors:
FUKUHARA KEI (JP)
YAMAZAKI KENTA (JP)
YAMAZAKI KENTA (JP)
Application Number:
PCT/JP2019/039779
Publication Date:
April 23, 2020
Filing Date:
October 09, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L79/08; C08K5/54; C08K5/56; C08L79/04; G03F7/004; G03F7/031; G03F7/037; G03F7/40
Domestic Patent References:
| WO2014097594A1 | 2014-06-26 | |||
| WO2015011893A1 | 2015-01-29 | |||
| WO2018025738A1 | 2018-02-08 |
Foreign References:
| JP2015219491A | 2015-12-07 | |||
| JP2007248767A | 2007-09-27 | |||
| JP2012088610A | 2012-05-10 | |||
| JP2011518747A | 2011-06-30 | |||
| CN104961672A | 2015-10-07 |
Other References:
KIM, HYUN TAE ET AL.: "C-H Alkenylation of Pyrroles by Electronically Matching Ligand Control", CHEMISTRY - AN ASIAN JOURNAL, vol. 13, no. 17, 5 June 2018 (2018-06-05) - 4 September 2018 (2018-09-04), pages 2418 - 2422, XP055702629
Attorney, Agent or Firm:
SIKs & Co. (JP)
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