Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/059622
Kind Code:
A1
Abstract:
A resin composition that comprises a precursor of a cyclization-product resin and compound B, which generates a base by the action of a base; a cured object obtained by curing the resin composition; a layered product including the cured object; a method for producing the cured object; and a semiconductor device including the cured object or the layered product.

Inventors:
ASAKAWA DAISUKE (JP)
YAMAUCHI AKIRA (JP)
Application Number:
PCT/JP2021/033356
Publication Date:
March 24, 2022
Filing Date:
September 10, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F290/14; B32B15/088; C08G73/06; C08G73/10; C08K5/205; C08L79/08; G03F7/004; G03F7/20; H05K1/03
Domestic Patent References:
WO2020066976A12020-04-02
WO2020066416A12020-04-02
Foreign References:
JP2008250111A2008-10-16
JP2019156801A2019-09-19
JP2003344992A2003-12-03
JP2013139566A2013-07-18
Attorney, Agent or Firm:
SIKs & Co. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCT...

Next Patent: COMPOSITION, SUBSTRATE WITH SURFACE LAYER, METHOD FOR PRODUCING SUBSTRATE WITH SURFACE LAYER, COMPOU...