Title:
RESIN COMPOSITION, CURED PRODUCT, ANTENNA ELEMENT AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/228815
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a resin composition which has a low dielectric loss tangent and a low linear thermal expansion coefficient, while exhibiting excellent coatability to substrates; a cured product which is obtained from this resin composition; an insulating film; an antenna element; and an electronic component. In order to solve the problem, a resin composition according to the present invention contains (A) a resin which contains at least one substance that is selected from the group consisting of a polyimide, a polyamide, a polybenzoxazole, precursors thereof and copolymers thereof, (B) inorganic particles which have an average particle diameter of 150 nm to 5 µm, and (C) an ester-based solvent. With respect to this resin composition, the component (A) contains a diamine residue of formula (1) and/or formula (2); and if Bm (mass) is the content of the component (B) and Cm (mass) is the content of the component (C), 0.1 ≤ (Bm/Cm) ≤ 3.0 is satisfied.
Inventors:
OGASAWARA HISASHI (JP)
ARAKI HITOSHI (JP)
JUKEI MASAYA (JP)
ARAKI HITOSHI (JP)
JUKEI MASAYA (JP)
Application Number:
PCT/JP2023/018261
Publication Date:
November 30, 2023
Filing Date:
May 16, 2023
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L79/08; C08G73/10; C08K3/013; C08L77/00; C08L79/04; H01L21/312; H01L23/12; H01L23/29; H01L23/31
Domestic Patent References:
| WO2021020344A1 | 2021-02-04 |
Foreign References:
| JP2020172663A | 2020-10-22 | |||
| JP2018184594A | 2018-11-22 | |||
| JP2021105146A | 2021-07-26 | |||
| JP2021095570A | 2021-06-24 | |||
| JP2022125999A | 2022-08-29 | |||
| JP2022132145A | 2022-09-07 |
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