Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, CURED PRODUCT PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/071226
Kind Code:
A1
Abstract:
A resin composition that satisfies at least one among condition 1 and condition 2, and that comprises at least one type of resin selected from the group consisting of cyclic resins and the precursors thereof, and a compound A, which has a molecular weight of less than 1000 and comprises a plurality of polymerizable groups bonded by linking groups having an imide structure; a cured product obtained by curing the resin composition; a laminate comprising the cured product; a method for producing the cured product; and a semiconductor device comprising the cured product and the laminate. Condition 1: The resin composition comprises a compound B having a polyalkyleneoxide structure; Condition 2: The compound A comprises a polyalkyleneoxide structure.
Inventors:
AOSHIMA TOSHIHIDE (JP)
Application Number:
PCT/JP2021/035395
Publication Date:
April 07, 2022
Filing Date:
September 27, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B15/088; C08F290/14; C08G73/10; C08K5/3415; C08L71/02; C08L79/04; G03F7/027; G03F7/20; H01L21/3205; H01L21/768; H01L23/532
Domestic Patent References:
| WO2015141618A1 | 2015-09-24 |
Foreign References:
| JP2004189768A | 2004-07-08 | |||
| JP2006133568A | 2006-05-25 | |||
| JP2018160665A | 2018-10-11 | |||
| JP2005320411A | 2005-11-17 | |||
| JP2003026727A | 2003-01-29 | |||
| JPH03271272A | 1991-12-03 | |||
| JP2013100441A | 2013-05-23 | |||
| JP2002148804A | 2002-05-22 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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