Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, CURED PRODUCT PRODUCTION METHOD, SEMICONDUCTOR DEVICE, AND POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/210532
Kind Code:
A1
Abstract:
The present invention pertains to a resin composition containing a polyimide precursor including a structure represented by formula (1-1) and a repeat unit represented by formula (2), a cured product obtained by curing the resin composition, a laminate including the cured product, a method for producing the cured product, and a semiconductor device including the cured product or the laminate, or a new polyimide precursor and a method for producing same.
Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2022/015002
Publication Date:
October 06, 2022
Filing Date:
March 28, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G73/10; B32B15/088; C08F299/02; G03F7/004; G03F7/027; G03F7/031
Domestic Patent References:
| WO2020189358A1 | 2020-09-24 | |||
| WO2021020344A1 | 2021-02-04 |
Foreign References:
| JPH11181091A | 1999-07-06 | |||
| JPH06172737A | 1994-06-21 | |||
| JP2020514422A | 2020-05-21 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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