Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, SEMICONDUCTOR DEVICE, AND RESIN
Document Type and Number:
WIPO Patent Application WO/2022/224838
Kind Code:
A1
Abstract:
Provided are: a resin composition that yields a cured product having exceptional elongation at break; a cured product obtained by curing the resin composition; a laminate containing the cured product; a method for producing the cured product; and a semiconductor device containing the cured product or the laminate, or a novel resin. The resin composition has repeating units represented by formula (1-1) and/or repeating units represented by formula (1-2).
Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2022/017267
Publication Date:
October 27, 2022
Filing Date:
April 07, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G73/10; C08F2/44; C08F290/14; C08G73/14; G03F7/027; G03F7/095; G03F7/20; G03F7/40
Foreign References:
| JPH07228777A | 1995-08-29 | |||
| JP2014148604A | 2014-08-21 | |||
| JP2014178666A | 2014-09-25 | |||
| JPS60228537A | 1985-11-13 |
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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