Title:
RESIN COMPOSITION, CURED RESIN PRODUCT AND MANUFACTURING METHOD OF CURED RESIN PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/063130
Kind Code:
A1
Abstract:
The resin composition contains compound (A) having a (meth)acryloyl group, compound (B) having an epoxy group and/or an oxetanyl group, radical polymerization initiator (C) and cationic polymerization initiator (D). The hydrogen bonding substituent value of one of compound (A) and compound (B) is 0.0001-0.1111 mol/g inclusive, and the hydrogen bonding substituent value of the other to the hydrogen bonding substituent value of the one is 2/3 or less. In a cured product of the resin composition, two or more peaks of loss factor tanδ are observed, the peaks including a first peak having the peak top position at a temperature of lower than 100°C and a second peak having the peak top position at a temperature of 100°C or higher, and the minimum value of loss factor tanδ at 100°C or lower is 0.1 or less.
More Like This:
Inventors:
HONDA HIDETAKA (JP)
Application Number:
PCT/JP2023/034252
Publication Date:
March 28, 2024
Filing Date:
September 21, 2023
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08L63/00; C08G18/67; C08G59/02
Domestic Patent References:
| WO2021200794A1 | 2021-10-07 | |||
| WO2005037876A1 | 2005-04-28 | |||
| WO2023090230A1 | 2023-05-25 |
Foreign References:
| JPH07258388A | 1995-10-09 | |||
| JP2005227367A | 2005-08-25 | |||
| JP2020078547A | 2020-05-28 | |||
| JPH06102693A | 1994-04-15 |
Attorney, Agent or Firm:
IKUMI PATENT ATTORNEYS OFFICE (JP)
Download PDF: