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Patent Searching and Data


Title:
RESIN COMPOSITION, CURED PRODUCT, MOLDING AND METHOD FOR PRODUCING SAME, FILM CAPACITOR AND METHOD OR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/087258
Kind Code:
A1
Abstract:
Provided is a resin composition for injection molding, containing a curable component and exfoliated graphite. Also provided is molding comprising an element and a sealing portion which seals the element, wherein the sealing portion contains the resin composition or a cured product thereof.

Inventors:
KAWABATA YASUNORI (JP)
NAKAMURA KASUMI (JP)
FUKUHARA TATSUHITO (JP)
IWAYA TAKAHIDE (JP)
Application Number:
PCT/JP2017/039161
Publication Date:
May 09, 2019
Filing Date:
October 30, 2017
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/42; C08K3/04; C08L101/00; H01G2/10; H01G4/18; H01G4/224; H01G9/08
Foreign References:
JP2001114990A2001-04-24
JP2000055293A2000-02-22
JP2009170882A2009-07-30
JP2006213786A2006-08-17
JP2001237142A2001-08-31
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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