Title:
RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/157911
Kind Code:
A1
Abstract:
The present invention provides a resin composition which contains a resin and a metallocene compound, wherein: the metallocene compound comprises a metal atom, an optionally substituted cyclopentadienyl ligand, and an aromatic ring that is directly bonded to the metal atom; the aromatic ring has, as a substituent which is directly bonded to the aromatic ring, an electron-withdrawing group that is different from a halogen atom; and the molar absorption coefficient of the metallocene compound at 500 nm is 330 mol-1∙L∙cm-1 or less. The present invention also provides: a cured product; a multilayer body which comprises a cured product; a method for producing a cured product; a method for producing a multilayer body; a method for producing a semiconductor device, the method comprising a method for producing a multilayer body; and a semiconductor device which comprises a cured product or a multilayer body.
Inventors:
DAIKUHARA KENJI (JP)
AOSHIMA TOSHIHIDE (JP)
ASAKAWA DAISUKE (JP)
OOTA KAZUYA (JP)
AOSHIMA TOSHIHIDE (JP)
ASAKAWA DAISUKE (JP)
OOTA KAZUYA (JP)
Application Number:
PCT/JP2023/005417
Publication Date:
August 24, 2023
Filing Date:
February 16, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L101/00; B32B15/08; B32B15/088; C08F283/04; C08F290/14; C08G73/10; C08K5/56; C08L79/08; G03F7/027; G03F7/029
Domestic Patent References:
| WO2021172420A1 | 2021-09-02 |
Foreign References:
| JPS61151197A | 1986-07-09 | |||
| JP2004184755A | 2004-07-02 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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